Hybrid sensor module and sensing method using the same
US7870678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | Mar 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10484
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a hybrid sensor module including first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB; a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.