Heat dissipating structure and lamp having the same
US7871184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 2008 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | Jan 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat dissipating structure includes a cover. The cover includes an inner heat dissipating body and an outer heat dissipating body. The inner heat dissipating body includes a cylinder and a plurality of first fins extending from an outer surface of the cylinder. The outer heat dissipating body includes a ring portion encircling a part of the inner heat dissipating body and a plurality of second fins extending from one side of the ring portion. In this way, more heat dissipating fins and larger heat dissipating surface area can be formed to enhance heat conduction and dissipation effect when restricted by the size of cover. A lamp with this heat dissipating structure is also provided. A service life of the LED in the lamp can be greatly prolonged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.