Method of making microstructure device, and microstructure device made by the same
US7871687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2007 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | Sep 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microstructure device is made by processing a material substrate consisting of e.g. a first process layer, a second process layer and a middle layer arranged between the first and the second process layers. The microstructure device includes a first structural part and a second structural part that has a portion facing the first structural part via a gap. The first and the second structural parts are connected to each other by a connecting part extending across the gap. This connecting part is formed in the first process layer to be in contact with the middle layer. The microstructure device also includes a protective part extending from the first structural part toward the second structural part or vice versa. The protective part is formed in the first or second process layer to be in contact with the middle layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.