Method and system for high-speed, precise micromachining an array of devices
US7871903B2 · kind B2 · utility
5Cited by
121References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2009 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | Dec 22, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.