Low formaldehyde emission fiberglass
US7872088B2 · kind B2 · utility
2Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | Mar 23, 2029 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD04H1/64
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed are binders including urea-extended phenol-formaldehyde alkaline resole resins to which melamine-containing resin has been added, and non-woven fiber compositions made therewith. The disclosed binders may be cured to low formaldehyde-emission and low trimethylamine-emission, water-resistant thermoset binders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.