Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit

US7872130B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Heiko Brunner · Berlin, DE
• Wolfgang Dahms · Berlin, DE
• Thomas Moritz · Berlin, DE
• Akif Özkök · Berlin, DE
• Udo Grieser · Berlin, DE

Key dates

• Filing date: Dec 9, 2003
• Grant date: Jan 18, 2011
• Expiry date: Apr 14, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/423
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae <I> and <II> set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds.