Laser bonding tool with improved bonding accuracy
US7872208B2 · kind B2 · utility
11Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2005 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | May 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.