Mounting board, height adjusting apparatus and mounting method
US7872875B2 · kind B2 · utility
1Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2007 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | May 1, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.