Manufacturing method for single chip COB USB devices with optional embedded LED
US7874067B1 · kind B1 · utility
4Cited by
26References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2008 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jul 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.