Patent · US Active

Method for the soldering repair of a component in a vacuum and an adjusted partial oxygen pressure

US7874473B2 · kind B2 · utility

6Cited by
26References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 15, 2008
Grant dateJan 25, 2011
Priority date
Expiry dateFeb 15, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49318
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.