Method for the soldering repair of a component in a vacuum and an adjusted partial oxygen pressure
US7874473B2 · kind B2 · utility
6Cited by
26References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2008 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Feb 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49318
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.