Electronic part and circuit substrate
US7874847B2 · kind B2 · utility
36Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2007 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jan 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.