Adhesive tape applying apparatus and tape splicing method
US7875138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2008 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Oct 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.