Method, system, program product for bonding two circuitry-including substrates and related stage
US7875528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2007 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jun 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method, system and program product for bonding two circuitry-including semiconductor substrates, and a related stage, are disclosed. In one embodiment, a method of bonding two circuitry-including substrates includes: providing a first stage for holding a first circuitry-including substrate and a second stage for holding a second circuitry-including substrate; identifying an alignment mark on each substrate; determining a location and a topography of each alignment mark using laser diffraction; creating an alignment model for each substrate based on the location and topography the alignment mark thereon; and bonding the first and second circuitry-including substrates together while aligning the first and second substrate based on the alignment model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.