Thermally conductive structure of LED and manufacturing method thereof
US7875900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2008 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jan 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/088
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.