Patent · US Expired

Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag

US7875975B2 · kind B2 · utility

2Cited by

70References

26Claims

0Family size

Assignee

PolyIC GmbH & Co. KG · DE

Inventors

Adolf Bernds · Baiersdorf, DE
Wolfgang Clemens · Puschendorf, DE
Walter Fix · Fürth, DE
Henning Rost · Erlangen, DE

Key dates

Filing date	Aug 17, 2001
Grant date	Jan 25, 2011
Priority date	—
Expiry date	Jul 12, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH10K77/111
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.