Form-less electronic device assemblies and methods of operation
US7876189B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2009 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Oct 1, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.