Patent · US Active

Method of attaching integrated circuits to a carrier

US7877876B2 · kind B2 · utility

4Cited by

20References

7Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

David Burke · Chatswood, AU
Jan Waszczuk · Sydney, AU
Desmond Bruce Boyton · Sydney, AU
Craig Donald Strudwicke · Sydney, AU
Peter John Morley Sobey · Sydney, AU
William Granger · Sydney, AU
Jason Mark Thelander · Chatswood, AU
Eric Patrick O'Donnell · Sydney, AU

Key dates

Filing date	Aug 19, 2008
Grant date	Feb 1, 2011
Priority date	—
Expiry date	Jan 16, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49401
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.