Method and device for heat treatment, especially connection by soldering
US7878386B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Apr 27, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D1/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.