Method and solution to grow charge-transfer complex salts
US7879263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Jan 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to methods and solutions for growing metal charge-transfer salts on a metal surface, such as a metal layer at the bottom of a via hole. The method makes use of a solution comprising a salt additive. The temperature during growth is in the range of −100° C. to +100° C. The method allows controlled growth of the metal charge transfer salt inside via hole while limiting growth outside the via hole. The method further limits corrosion of the metallic connections at the bottom of the via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.