Electronic device substrate, electronic device and methods for making same
US7880091B2 · kind B2 · utility
9Cited by
3References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2006 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Sep 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.