Differential signal layout printed circuit board
US7880094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Nov 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A positive differential signal trace and a negative differential signal trace are formed on different layers of a printed circuit board. A first ground trace is formed on the layer on which the positive differential signal trace is formed, and a second ground trace is formed on the layer on which the negative differential signal trace is formed. An insulation layer is positioned between the two layers and has a predetermined thickness. A differential mode impedance and a common mode impedance of differential signals are dependent on the predetermined thickness of the insulation layer, width and thickness of each differential signal trace, and a space between each differential signal trace and the corresponding ground trace formed on the same layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.