Method and apparatus for material processing

US7880114B2 · kind B2 · utility

Assignee

• LOMA LINDA UNIVERSITY MEDICAL CENTER · US

Inventors

• Paul E. Denney · Columbus, US
• Jay R. Eastman · Westerville, US
• Paul M. Fallara · Columbus, US
• Andrew P. Joseph · Johnstown, US
• John S. Phillips · Purchase, US
• Ta-Chieh Huang · Dublin, US
• Michael N. Patena · Pataskala, US
• Tim Burnham · Reynoldsburg, US
• Paul Coleman · Minneapolis, US

Key dates

• Filing date: Apr 10, 2006
• Grant date: Feb 1, 2011
• Expiry date: May 27, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/1464
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An apparatus processes a surface of an inhabitable structure. The apparatus includes a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit includes an energy wave generator and a head coupled to the energy wave generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further includes a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.