Semiconductor device and method of manufacturing the same
US7880178B2 · kind B2 · utility
2Cited by
1References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2008 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Dec 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/18375
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a semiconductor device realizing reduced occurrence of a defect such as a crack at the time of adhering elements to each other. The semiconductor device includes a first element and a second element adhered to each other. At least one of the first and second elements has a pressure relaxation layer on the side facing the other of the first and second elements, and the pressure relaxation layer includes a semiconductor part having a projection/recess part including a projection projected toward the other element, and a resin part filled in a recess in the projection/recess part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.