Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
US7880279B2 · kind B2 · utility
1Cited by
6References
7Claims
0Family size
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Key dates
| Filing date | Jan 30, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Nov 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.