Apparatus and method of single-in-line embedded modem
US7881457B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2003 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Sep 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M11/066
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The invention is a compact embedded modem that meets global telephone standards with its interface constructed in a single-in-line form factor. The modem in single-in-line form factor, namely SIP modem, can be integrated into a host system through a single-in-line header socket. The SIP interface includes TIP and RING signals for connecting to a phone line, isolation spacers, ground pin, power pin, and digital signals for transferring data to and from the host. The digital interface can be configured to operate in serial connection or in parallel connection to the host, selectable by user.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.