Semiconductor device metal programmable pooling and dies
US7882453B2 · kind B2 · utility
3Cited by
19References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | May 28, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2115/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A pool of die designs includes die designs having metal programmable base layers. Die designs from the pool are selected for use in fabricating dies. Die designs are added to the pool by customization of die designs already in the pool or by preparing custom die designs that incorporate a metal programmable base layer. In some embodiments multi-tile dies are provided with I/O slots configurable for either inter tile communication or inter die communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.