Patent · US Active

Apparatus for bonding rubber O-Rings and extrusions

US7882879B2 · kind B2 · utility

3Cited by
6References
20Claims
0Family size

Inventors

Key dates

Filing dateJul 26, 2008
Grant dateFeb 8, 2011
Priority date
Expiry dateJul 15, 2029

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/26
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Apparatus for bonding rubber O-Rings from cord stock, rubber extrusions and extruded tubing materials, consists of heated die-sets, holding fixtures, electronic module, assembly device, spring clamping and pneumatic clamping arrangement. The combined heated die-set and holding fixture are two separable heat conductive blocks having a common interface. Apertures are located across the interface having diameters or matching shapes of extrusions, these apertures are slightly less than the cord or extrusion dimensions, the rubber is axially mated in the open heated aperture, and will stay unlovable when the clamping device is closed. The electronic module controls both a heating and timing device for proper control of maintaining a constant temperature and accurate timing cycle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.