Electrocoated contacts compatible with surface mount technology
US7883340B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 30, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Nov 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.