Use of a titanium-copper-nickel-based alloy
US7883744B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Oct 21, 2005 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Feb 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/149
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A titanium-copper-nickel based alloy is used for the formation of at least one resistive thin film on a polymer substrate. The alloy comprises 50 to 80% by weight of titanium, 10 to 25% by weight of copper and 10 to 25% by weight of nickel. The thin film has a thickness between about 100 and 160 nanometres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.