Multiple layer polymer interlayers having an embossed surface
US7883761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Jul 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31946
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides multiple layer interlayers having a relatively soft inner layer and relatively stiff outer layers that can be laminated without unacceptable optical distortion and used in various multiple layer glass panel type applications. Multiple layer interlayers of the present invention have surface topography that is formed by embossing the exposed surface of the interlayer, or individual layers of the multiple layer interlayer, after formation of the interlayer or layers. The embossing process is carried out under temperature conditions that prevent the transfer of the embossing to inner layers of the interlayer. By precisely controlling the embossing of the interlayer, lamination of the interlayer with a rigid substrate does not lead to unacceptable optical distortion caused by the transfer of the surface topography through outer, stiffer layers into softer, internal layers of the interlayer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.