Connecting device for electronic components
US7884287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2007 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Sep 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite sides of the insulating film. The film composite is formed as a layer construction of a conductive film alternating with an insulating film, wherein at least one conductive film is structured and thus forms conductor tracks. Furthermore, at least one conductive film of a main area of the film composite is made of a first metal and has at least one film section having a layer of a second metal that is thinner in comparison with the thickness of the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.