Light emitting diode package structure and lead frame structure thereof
US7884378B1 · kind B1 · utility
3Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Oct 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED package structure includes a frame, at least a first LED, and at least a second LED. The frame includes a base having a first cavity and a second cavity, where the second cavity is disposed under the first cavity and the second cavity is smaller than the first cavity. The first LED is disposed in the bottom of the first cavity, and the second LED is disposed in the bottom of the second cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.