Semiconductor device having a mounting substrate with a capacitor interposed therebetween
US7884443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2006 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Feb 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A capacitor-equipped semiconductor device includes a semiconductor chip having a plurality of electrode terminals; a sheet-like substrate at least having a film capacitor; and a mounting substrate. The mounting substrate is provided on one side thereof with chip connection terminals and ground terminals. The chip connection terminals are disposed to correspond to the electrode terminals of the semiconductor chip. The ground terminals are disposed to correspond to the one electrode terminals of the film capacitor of the sheet-like substrate. The mounting substrate is provided on the other side thereof with external connection terminals connected to the chip connection terminals and the ground terminals and used to mount the mounting substrate on an external substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.