Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
US7884456B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2008 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Dec 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09127
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.