MEMS fabrication on a laminated substrate

US7884689B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Bedri A. Cetiner · Irvine, US
• Mark Bachman · Irvine, US
• Guann-Pyng Li · Irvine, US
• Jiangyuan Qian · Irvine, US
• Hung-Pin Chang · Taipei, TW
• Franco De Flaviis · Irvine, US

Key dates

• Filing date: Jul 3, 2006
• Grant date: Feb 8, 2011
• Expiry date: Jul 3, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q1/38
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature disposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.