Residual stress measuring method and system
US7884924B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2007 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Jun 10, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/241
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A residual stress measuring method capable of measuring residual stress of the surface of an object to be inspected rapidly in a non-destructive non-contact manner, as well as a residual stress measuring system having such characteristics and being high in portability, are provided. The residual stress measuring system comprises a heating laser for heating an inspection area of an object to be inspected, a laser interferometer for irradiating the inspection area interferometric with laser light and measuring a deformation quantity within an elastic deformation range upon stress relief by heating in accordance with a laser interferometric method, and a data processor for measuring residual stress from the deformation quantity within the elastic deformation range upon stress relief of the object to be inspected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.