Airflow/cooling solution for chassis with orthogonal boards
US7885066B2 · kind B2 · utility
22Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Oct 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.