Heat dissipation device
US7885073B2 · kind B2 · utility
10Cited by
8References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 10, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Jun 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.