Heat dissipation device
US7885075B2 · kind B2 · utility
10Cited by
6References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 3, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Apr 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.