Apparatus for and method of cooling molded electronic circuits
US7885076B2 · kind B2 · utility
5Cited by
32References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2005 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Nov 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.