Component mounting apparatus, service providing device and servicing method
US7885718B2 · kind B2 · utility
31Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Apr 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.