Ultrasonic reclaim method for disk drive suspensions
US7886422B1 · kind B1 · utility
8Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2008 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Jul 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53161
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for reclaiming a suspension from a disk drive head gimbal assembly (HGA). An ultrasonic probe is applied to the HGA's read/write head slider on a side opposite that of its solder balls. Ultrasonic oscillations are transmitted through the ceramic slider to the side with the solder balls. The oscillations break the brittle intermetallic compound of the slider balls and free the slider. The ultrasonic energy also weakens the epoxy adhesive between the slider and suspension. The method can be used with heat to further weaken the solder balls and adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.