Process for forming an isolated electrically conductive contact through a metal package
US7886437B2 · kind B2 · utility
10Cited by
32References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Jan 8, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.