Installation for the vacuum treatment in particular of substrates
US7886686B2 · kind B2 · utility
2Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Mar 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/677
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Installation for vacuum treatment, particularly of substrates, includes several identical independent and aligned modules. Each module is provided with a vacuum treatment chamber and a transfer chamber having a mechanism for transferring a substrate within one of the different chambers or from one chamber to another, the second chamber being located downstream or upstream from, directly next to, or separated by at least one module from the first chamber. A substrate can be transferred into one chamber in order to undergo a treatment while another substrate is placed in a different chamber for a specific treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.