Acid copper electroplating bath composition
US7887693B2 · kind B2 · utility
1Cited by
14References
17Claims
0Family size
Inventors
Key dates
| Filing date | Jun 22, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | May 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (b) a brightener comprising at least one divalent sulfur compound; and (c) a leveler comprising a heterocyclic nitrogen compound. The improved electroplating composition is usable for plating through holes in printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.