Magnetic self-assembly for integrated circuit packages
US7888140B2 · kind B2 · utility
3Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Sep 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.