Method of manufacturing a photoelectronic device
US7888162B2 · kind B2 · utility
0Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Jul 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
This application discloses a method of manufacturing a photoelectronic device comprising steps of providing a semiconductor stack layer, forming at least one metal adhesive on the semiconductor stack layer by a printing technology, forming an electrode by heating the metal adhesive to remove the solvent in the metal adhesive, wherein an ohmic contact is formed between the electrode and the semiconductor stack layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.