Method of forming phase change memory devices in a pulsed DC deposition chamber
US7888240B2 · kind B2 · utility
52Cited by
2References
19Claims
0Family size
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Key dates
| Filing date | Oct 10, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Apr 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/8828
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A phase change memory including an ovonic threshold switch is formed using a pulsed direct current (DC) deposition chamber using pulsed DC. Pulsed DC is used to deposit a chalcogenide film. Pulsed DC may be also used to deposit a carbon film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.