Methods of repairing a substrate
US7888277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Nov 18, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/5445
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting of aluminum oxide, aluminum nitride, boron carbide, boron oxide, boron nitride, hafnium boride, hafnium carbide, hafnium oxide, lithium aluminate, molybdenum silicide, niobium carbide, niobium nitride, silicon boride, silicon carbide, silicon oxide, silicon nitride, tin oxide, tantalum boride, tantalum carbide, tantalum oxide, tantalum nitride, titanium boride, titanium carbide, titanium oxide, titanium nitride, yttrium oxide, zirconium boride, zirconium carbide, zirconium oxide, and zirconium silicate. Methods of forming the ceramic adhesive and of repairing a substrate in a vacuum and microgravity environment are also disclosed, as is a substrate repaired with the ceramic adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.