Aromatic polyamide and epoxy group-containing phenoxy resin
US7888434B2 · kind B2 · utility
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Key dates
| Filing date | May 17, 2006 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Feb 25, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.